Microfabrication processes for CMOS, bipolar, MEMS, and microfluidics devices. Laboratory safety. Deposition processes of oxidation, evaporation and sputtering. Lithography, wet and dry etch, and device characterization. Note: Consent of Department required. Credit may be obtained in only one of ECE 457 or E E 457.
Microfabrication processes for CMOS, bipolar, MEMS, and microfluidics devices. Laboratory safety. Deposition processes of oxidation, evaporation and sputtering. Lithography, wet and dry etch, and device characterization. Note: Consent of Department required. Credit may be obtained in only one of ECE 457 or E E 457.
