Review of semiconductor materials, integrated circuit processing, and basic design flows using CAD tools. Electrical characteristics of interconnect, passive elements, diodes, MOSFETs and logic gates. Sequential elements, memory and datapath circuits. Pad design. Chip-level design including power and clock distribution. Scaling theory. Testing and design for testability. Emerging technologies. Note: Only one of the following courses may be taken for credit: ECE 553 or E E 483 or 653.
Review of semiconductor materials, integrated circuit processing, and basic design flows using CAD tools. Electrical characteristics of interconnect, passive elements, diodes, MOSFETs and logic gates. Sequential elements, memory and datapath circuits. Pad design. Chip-level design including power and clock distribution. Scaling theory. Testing and design for testability. Emerging technologies. Note: Only one of the following courses may be taken for credit: ECE 553 or E E 483 or 653.
