Examine the principles of materials science pertaining to metallization & packaging in microelectronics. Key topics include technology requirements & trends, the impact of device scaling on performance & technology, multilayered interconnect structures, integration of copper & low-k dielectrics, polymers in microelectronics, chip package interaction, back-end-of-the-line processing, & wire bonding process.
Examine the principles of materials science pertaining to metallization & packaging in microelectronics. Key topics include technology requirements & trends, the impact of device scaling on performance & technology, multilayered interconnect structures, integration of copper & low-k dielectrics, polymers in microelectronics, chip package interaction, back-end-of-the-line processing, & wire bonding process.
